外文翻译-一个概念的整合环氧胶工艺设计和控制的方法.doc
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1、A Conceptual Approach to Integrate Design and Control for the Epoxy Dispensing ProcessH.-X. Li, S. K. Tso and H. DengDepartment of Manufacturing Engineering and Engineering Management, School of Science and Engineering, City University of Hong Kong, Hong KongPerformance improvement of manufacturing
2、systems in the semiconductor industry involves interdisciplinary expertise, such as physical modeling, mechanical design, electrical control, and even material science. Integration of these different disciplines is a challenging problem in the semiconductor industry. The paper presents a conceptual
3、approach to integrate design and control methodology for complex processes with specific application to an epoxy-dispensing control systema critical equipment in the semiconductor packaging process. This methodology includes three hierarchical levels: process design (system-level and component-level
4、), multivariable control and the statistics-based supervision. This paper deals with conceptual design at system-level by integrating an approximate model with an axiomatic approach, and briefly introduces approaches at other levels. In the conceptual design at system level, the primitive model of t
5、he system is sufficient to show some basic properties of the process, by which the axiomatic design can be easily integrated to evaluate the system design and suggest an optimal system configuration with invariant properties to internal variations. Under minimal internal variation, the multivariable
6、 control that is intended to suppress external variations can be approximately constructed by a set of independent controllers. Statistics-based supervision will provide suitable setpoints for the multivariable control so as to maintain good performance in the dynamic environment.Keywords: Conceptua
7、l and axiomatic design; Epoxy dispensing process; Hybrid process control1. IntroductionManufacturing systems in the semiconductor industry are processes with a high degree of complexity, consisting of heterogeneous subsystems and materials. Design and control for this kind of system involve differen
8、t domains, such as, mechanical engineering, electrical control, software and hardware, and even material science and physics. A typical example is an epoxy dispenser which is widely used in the semiconductor industry where accurate fluid control is needed. In the die bonding process in the semicondu
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